Cassandra Moers, Christian Dresbach, Holm Altenbach: A Fatigue Lifetime Prediction Model for Aluminum Bonding Wires. In: Metals, 13(10), 1781, 2023
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Patrick Michels, Christian Dresbach, Esther Ramakers-van Dorp, Holm Altenbach, Olaf Bruch: Application of Nonlinear Viscoelastic Material Models for the Shrinkage and Warpage Analysis of Blow Molded Parts. In: Altenbach, Naumenko (Ed.): Creep in Structures VI. IUTAM Symposium Proceedings, 2023, S. 205-232
doi:10.1007/978-3-031-39070-8_13 BibTeX | RIS

Michael Meurer, Gatien Kamsu Fogain, Esther Ramakers van Dorp, Christian Dresbach, Bernhard Möginger, Berenika Hausnerova: Rate dependent tack behavior of silicone-based pressure sensitive adhesives for transdermal therapeutic systems. Preprint, 2023
doi:10.21203/rs.3.rs-3010924/v1 BibTeX | RIS

Cassandra Moers, Christian Dresbach: Influence of R-Ratio on Fatigue of Aluminum Bonding Wires. In: Metals, 13(1), 9, 2022
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C. Dresbach, J. Wischek, M. Bartsch, T. Prien: A small‐scale creep test for calibrating an efficient lifetime model for high pressure turbine blades. In: Materialwissenschaft und Werkstofftechnik, 53(4), 2022, S. 440-448
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Joachim Gussone, Katrin Bugelnig, Pere Barriobero-Vila, Julio Cesar da Silva, Ulrike Hecht, Christian Dresbach, Federico Sket, Peter Cloetens, Andreas Stark, Norbert Schell, Jan Haubrich, Guillermo Requena: Ultrafine eutectic Ti-Fe-based alloys processed by additive manufacturing – A new candidate for high temperature applications. In: Applied Materials Today, 20(September 2020), 100767, 2020
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Marinus Johannus van Enkhuizen, Christian Dresbach, Stefan Reh, Stefan Kuntzagk: Efficient Lifetime Prediction of High Pressure Turbine Blades in Real Life Conditions. In: ASME Turbo Expo 2017: Turbomachinery Technical Conference and Exposition, June 26–30, 2017, Charlotte, North Carolina, USA, 2017
doi:10.1115/GT2017-63341 BibTeX | RIS

Clemens Buske, Alexander Krumme, Thomas Schmidt, Christian Dresbach, Sascha Zur, Rüdiger Tiefers: Distributed Multidisciplinary Optimization of a Turbine Blade Regarding Performance, Reliability and Castability. In: International Gas Turbine Institute, American Society of Mechanical Engineers 2016 – ASME Turbo Expo, 2016
doi:10.1115/GT2016-56079 BibTeX | RIS

Christian Dresbach, Thomas Becker, Stefan Reh, Janine Wischek, Sascha Zur, Clemens Buske, Thomas Schmidt, Ruediger Tiefers: A Stochastic Reliability Model for Application in a Multidisciplinary Optimization of a Low Pressure Turbine Blade Made of Titanium Aluminide. In: Latin American Journal of Solids and Structures, 13(12), 2016, S. 2316-2332
doi:10.1590/1679-78252521 BibTeX | RIS

Thomas Becker, Christian Dresbach, Stefan Reh: Adaption of a material model and development of a stochastic failure criterion for ceramic matrix composite structures. In: Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications, 230(3), 2016, S. 813-824
doi:10.1177/1464420715592188 BibTeX | RIS

Christian Dresbach, Marinus J. van Enkhuizen, Ulises Alfaro Mercado, Stefan Reh: Simulation of thermal behavior during friction stir welding process for predicting residual stresses. In: CEAS Aeronautical Journal, 6(2), 2014, S. 271-278
doi:10.1007/s13272-014-0145-9 BibTeX | RIS

C. Dresbach, U. Dressler, J. Gussone, S. Reh: Calculation of effective Young's modulus distribution from electron backscatter diffraction results for stochastic analyses in aerospace applications. In: Materialwissenschaft und Werkstofftechnik, 45(5), 2014, S. 361-370
doi:10.1002/mawe.201400235 BibTeX | RIS

Marinus Johannus van Enkhuizen, Christian Dresbach, Stefan Reh: Determining Local Material Properties via Inverse Parameter Identification of Instrumented Indentation Experiments. In: NAFEMS World Congress NWC2013, 09.-12. Jun. 2013, Salzburg, Österreich, 2013
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Holm Altenbach, Christian Dresbach, Matthias Petzold: Characterizing the Anisotropic Hardening Behavior of Aluminum Bonding Wires. In: Silva, Altenbach et al. (Eds.): Materials with Complex Behaviour II. Properties, Non-Classical Mater. Advanced Structured Materials, vol 16, Berlin, Heidelberg: Springer, 2012, S. 583-598
doi:10.1007/978-3-642-22700-4_36 BibTeX | RIS

Christian Dresbach, Georg Lorenz, Matthias Petzold, Holm Altenbach: Analysis of Chip Damage Risk in Thermosonic Wire Bonding. In: Key Engineering Materials, Vol.478, 2011, S. 75-80
doi:10.4028/www.scientific.net/KEM.478.75 BibTeX | RIS

G. Lorenz, M. Petzold, M. Mittag, C. Dresbach, E. Milke: Mechanical characterization of gold and copper free air balls in thermosonic wire bond interconnections. In: 3rd Electronic System-Integration Technology Conference ESTC, 13-16 Sept. 2010, Berlin, Germany, 2010, S. 1-6
doi:10.1109/ESTC.2010.5642816 BibTeX | RIS

M. Krause, B. Marz, C. Dresbach, M. Petzold: Electron backscatter diffraction microstructure investigations of electronic materials down to the nanoscale. In: 3rd Electronic System-Integration Technology Conference ESTC, 13-16 Sept. 2010, Berlin, Germany, 2010, S. 1-6
doi:10.1109/ESTC.2010.5642809 BibTeX | RIS

C. Dresbach, M. Mittag, M. Petzold: Elastic properties of bonding wires. In: 3rd Electronic System-Integration Technology Conference ESTC, 13-16 Sept. 2010, Berlin, Germany, 2010, S. 1-4
doi:10.1109/ESTC.2010.5642992 BibTeX | RIS

Sandy Bennemann, Christian Dresbach, Georg Lorenz, Lutz Berthold, Matthias Petzold: Microstructure and mechanical properties of laser ablation cleaned NiP platings for aluminum wire bonding. In: 3rd Electronic System-Integration Technology Conference ESTC, 13-16 Sept. 2010, Berlin, Germany, 2010, S. 1-5
doi:10.1109/ESTC.2010.5642852 BibTeX | RIS

Kerstin Nötzold, Christian Dresbach, Jürgen Graf, Bianca Böttge: Temperature dependent fracture toughness of glass frit bonding layers. In: Microsystem Technologies, 16(7), 2010, S. 1243-1249
doi:10.1007/s00542-010-1037-5 BibTeX | RIS

C. Dresbach, M. Mittag, M. Petzold, E. Milke, T. Müller: Mechanical properties and microstructure of heavy aluminum bonding wires for power applications. In: 2009 European Microelectronics and Packaging Conference, EMPC 2009, 15-18 June 2009, Rimini, 2009
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C. Dresbach, G. Lorenz, M. Mittag, M. Petzold, E. Milke, T. Müller: Local Hardening Behavior of Free Air Balls and Heat Affected Zones of Thermosonic Wire Bond Interconnections. In: 2009 European Microelectronics and Packaging Conference, EMPC 2009, 15-18 June 2009, Rimini, 2009
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Seung-Mo Lee, Eckhard Pippel, Ulrich Gösele, Christian Dresbach, Yong Qin, C. Vinod Chandran, Thomas Bräuniger, Gerd Hause, Mato Knez: Greatly increased toughness of infiltrated spider silk. In: Science, 324(5926), 2009, S. 488-492
doi:10.1126/science.1168162 PMID BibTeX | RIS

Seung-Mo Lee, Gregor Grass, Gyeong-Man Kim, Christian Dresbach, Lianbing Zhang, Ulrich Gösele, Mato Knez: Low-temperature ZnO atomic layer deposition on biotemplates: flexible photocatalytic ZnO structures from eggshell membranes. In: Physical Chemistry Chemical Physics, 11(19), 2009, S. 3608-3614
doi:10.1039/b820436e PMID BibTeX | RIS

K. Nötzold, C. Dresbach, J. Graf, B. Böttge: Temperature dependent fracture toughness of glass frit bonding layers. In: Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), 1-3 April 2009, Rome, Italy, 2009
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L. Merkle, T. Kaden, M. Sonner, A. Gademann, J. Turki, C. Dresbach, M. Petzold: Mechanical fatigue properties of heavy aluminium wire bonds for power applications. In: 2nd Electronics System-Integration Technology Conference, ESTC 2008, 1-4 Sept. 2008, Greenwich, UK, 2008, S. 1363-1368
doi:10.1109/ESTC.2008.4684554 BibTeX | RIS

Bianca Boettge, Christian Dresbach, Andreas Graff, Matthias Petzold, Joerg Bagdahn: Mechanical Characterization and Micro Structure Diagnostics of Glass Frit Bonded Interfaces. In: ECS Transactions, 16(8), 2008, S. 441-448
doi:10.1149/1.2982898 BibTeX | RIS

C. Dresbach, H. Knoll, J. Schischka, M. Petzold, K. Hosseini, L. Schrapler: Test Methods for Characterizing the Local Plastic Deformability of Bonding Wires. In: 1st Electronic Systemintegration Technology Conference, 5-7 Sept. 2006, Dresden, Germany, 2007, S. 732-740
doi:10.1109/ESTC.2006.280093 BibTeX | RIS

M. Petzold, C. Dresbach, M. Ebert, J. Bagdahn, M. Wiemer, K. Glien, J. Graf, R. Muller-Fiedler, H. Hofer: Fracture mechanical life-time investigation of glass-frit bonded MEMS sensors. In: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. 30 May - 02 June 2006, San Diego, CA, USA, 2006, S. 1343-1348
doi:10.1109/ITHERM.2006.1645501 BibTeX | RIS

C. Dresbach, A. Krombholz, M. Ebert, J. Bagdahn: Mechanical properties of glass frit bonded micro packages. In: Microsystem Technologies, 12(5), 2005, S. 473-480
doi:10.1007/s00542-005-0031-9 BibTeX | RIS

M. Ebert, C. Dresbach, A. Krombholz, J. Bagdahn, K. Glien, J. Graf, R. Müller-Fiedler, H. Hofer: Mechanical Failure Behavior of Glass Frit Bonded Structures. In: Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Montreux, Switzerland, 01.-03.06.2005, 2005
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