WireLife - Lifetime of new aluminum wires of power electronics

In WireLife, computer models are to be developed and backed up with experimental data that will make it possible to reduce the manufacturing costs of wires and ribbons without at the same time reducing the performance of the connections. Furthermore, the development of new high-performance alloys and their market introduction will be supported. For this purpose, numerical prediction models of the standard manufacturing process as well as alternative manufacturing routes will be developed and validated with experimental investigations on a commercial aluminum alloy. In addition, detailed lifetime models will be developed taking into account temperature-dependent material properties as well as microstructure-based anisotropy and, if necessary, crystal plasticity. Hereby, new alloy variants with better temperature stability and conductivity will be investigated and evaluated with respect to their applicability in power electronics. The industrial applicability will be verified by bonding tests and application-related electrical load tests.